Add a highly integrated RF and baseband chipset and ready-to-go-wireless module to the rapidly expanding list of components vying for use in the many Bluetooth products under development by OEMs ...
Introducing the industry's first complete chipset solution for 200G and 400G CWDM optical module providers servicing Cloud Data Center applications. This solution enables 200G modules at under 4.5W ...
Norwood, M.A. —Analog Devices, Inc. announced its new XFP (10 Gbit small form-factor pluggable) optical transceiver chipset and reference design. XFP is rapidly becoming the leading standard for ...
Fujitsu Microelectronics America's mobile WiMAX chipset includes all three devices essential to a WiMAX module: a baseband IC, the MB86K22; an RF IC, the MB86K52; and a power management IC, the ...
SHENZHEN, China--(BUSINESS WIRE)--Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA ...
The circuitry needed to control multi-line character display modules has been integrated into a chipset consisting of an 18-bit A/D converter and a pre-programmed microprocessor. Designed to minimize ...
SAN JOSE, Calif.--(BUSINESS WIRE)---- (NASDAQ: ), a premier chip and silicon IP provider making data faster and safer, today announced the availability of its new family of state-of-the-art DDR5 ...
Powering next-gen LPWA solutions with an ultra-low power 5G cellular+ module for IoT Building on the success of Sierra Wireless’ existing HL78 Series LPWA modules, the HL7900 with its ALT1350 chipset ...
Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is ...