Data centers have a unique opportunity to promote large-scale change in sustainable waste management by adopting a circular ...
Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...
At this year's Sustainable Packaging Summit, taking place in Utrecht from 10th-12th November, Trayak will be hosting an ...
The Internet of Things (IoT), Big Data, cloud, and consumer-based technologies are changing how companies drive more value and new revenue opportunities. No industry, segment, or market is immune.
Anhui Dong'ou Machinery Obtains Patent for Electric Vehicle Lithium Battery Packaging Structure, Which May Significantly Enhance Range. Anhui Dong'ou Machinery Technology Co., Ltd ...
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