The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...
Allegro MicroSystems, LLC introduces a new customer programmable, high accuracy linear Hall effect-based current sensor IC. Allegro's A1369 is packaged in a thin 3-pin SIP package to allow for easy ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
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