Semiconductor Engineering

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Hosted on MSN

New 3D-stacked memory tech seeks to dethrone HBM in AI inference — d-Matrix claims 3DIMC will be 10x faster and 10x more efficient

Memory startup d-Matrix is claiming its 3D stacked memory will be up to 10x faster and run at up to 10x greater speeds than HBM. d-Matrix's 3D digital in-memory compute (3DIMC) technology is the ...
Semiconductor Engineering

AI Memory: Enabling The Next Era Of High-Performance Computing

The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions. AI-driven applications are fueling significant year-over-year growth in ...
Electronic Design

HBM4 Fuels Next-Gen AI with Unprecedented Memory Bandwidth

The debut of DeepSeek R1 sent ripples through the AI community, not just for its capabilities, but also for the sheer scale of its development. The 671-billion-parameter, open-source language model’s ...
Forbes

HBM And Emerging Memory Technologies Enable AI Training And Inference

Forbes contributors publish independent expert analyses and insights. During congressional hearing in the House of Representatives’ Energy & Commerce Committee Subcommittee of Communication and ...