Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower ...

The next big leap in CPU design won’t come from adding more cores, chasing smaller nodes, or stacking additional chiplets onto one CPU. That's not to say that things like AMD's 3D V-Cache aren't good, ...

As the semiconductor industry gears up for backside power delivery at the 2nm node, implementation of the technology requires a re-thinking of established design practices. While some EDA tools are ...

Through the looking glass: Many advances in semiconductor technology hinge on reducing package sizes while incorporating added functionality and more efficient power delivery methods. Present methods ...