The accelerating rate at which the industry adopts new process nodes is posing critical test challenges. Shrinking geometries combined with increased design complexity with respect to metrics such as ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
Zhao Jianhui, the 66-year-old chairman of Epiworld International, joins the billionaire ranks following his company’s $209 million Hong Kong IPO. Zhao Jianhui, the founder and chairman of Epiworld ...
A powerful light source bigger than a London double-decker bus has set a record: it can create structures on a silicon wafer that are just 8 nanometres (nm) wide. Those are thought to be the smallest ...
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