On-wafer probing techniques have become indispensable in the precise characterisation of semiconductor devices operating in the microwave and terahertz regions. These techniques enable the direct ...

Wafer probe, one of the key processes for ensuring reliability in semiconductor manufacturing, is becoming increasingly unreliable in multi-die assemblies and at leading-edge nodes. For much of the ...

Seamlessly integrated system combines TITAN™ Probes and MPI's wafer-level expertise to unlock precision measurements for next-generation semiconductors and sub-THz applications This latest milestone ...

PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate ...

PI's latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. (Nanowerk News) PI ...

It took scientists just 0.9 megapascals of pressure to pierce a problem holding back the next wave of display technology. At Tianjin University, researchers have unveiled a groundbreaking method to ...

Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Probing solution is industry first to operate at bandwidths greater than 50 GHz with high-impedance probe head High-impedance, turnkey solution delivers bandwidths up to 52 GHz Brickwall and 40 GHz ...

SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...

Add Yahoo as a preferred source to see more of our stories on Google. It took scientists just 0.9 megapascals of pressure to pierce a problem holding back the next wave of display technology. At ...