Semiconductor Engineering1d
Manipulating Diamond Surface Chemistry By UV Laser Etching (Macquarie Univ., MIT)
A new technical titled “The effects of sub-monolayer laser etching on the chemical and electrical properties of the (100) ...
Semiconductor Engineering7h
98 Hardware Security Failure Scenarios (NIST)
A new technical paper titled “Hardware Security Failure Scenarios: Potential Hardware Weaknesses” was published by NIST.
Semiconductor Engineering11h
The Vulnerability of Clock Trees to Asymmetric Aging
A new technical paper titled “The Impact of Asymmetric Transistor Aging on Clock Tree Design Considerations” was published by ...
Semiconductor Engineering22h
Chip Companies Play Bigger Role In Shaping University Curricula
Design and AI companies are using a range of tools to help graduates become productive more quickly. Some are feeding their ...
Semiconductor Engineering1d
Research Bits: Dec. 3
Researchers from North Carolina State University and Iowa State University demonstrated a technique for self-assembling ...
Semiconductor Engineering1d
Chiplet-Based NPUs to Accelerate Vehicular AI Perception Workloads
A new technical paper titled “Performance Implications of Multi-Chiplet Neural Processing Units on Autonomous Driving ...
Semiconductor Engineering6d
Aging, Complexity, And AI In Analog Design
Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...
Semiconductor Engineering6d
STCO for Dense Edge Architectures using 3D Integration and NVM (imec,, et al.)
Technology Co-Optimization for Dense Edge Architectures using 3D Integration and Non-Volatile Memory” was published by ...
Semiconductor Engineering6d
Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...
Semiconductor Engineering6d
Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)
Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was ...
Semiconductor Engineering5d
Chip Industry Week In Review
The chip industry is still on track to hit $1 trillion annually by 2030, according to PWC‘s new State of the Semiconductor Industry report. Key drivers for growth are electrification, digitization, ...